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Plating diamond micro-powder M-TJSD-P

Plating diamond micro-powder M-TJSD-P

1. Improving retention and controlling property of particles
2. Protecting synthetic diamonds in the process of sintering tools
3. Improving the heat dissipation capacity of active particles and prolonging the service life of tools.


Application:

1. Mainly applied for dry and wet grinding products of resin binder; 2. Suitable for contact and electrode of electronic products.

  • Product characteristics
  • Specification parameters
  • Application area
  • Product Graphic Appreciation


Through low carbon and environmental protection technology, the surfaces of diamond are coated with a layer of metal in order to improve their holding power, mitigate thermal shock, protect diamond from oxidation and graphitization, and prolong the service life of products.



Plating diamond micro-powder  specification(μm)

4-85-106-128-128-16
10-1510-2012-2215-2520-30
22-3620-4030-4040-5050-60



1. Mainly applied for dry and wet grinding products of resin binder;

2. Suitable for contact and electrode of electronic products.