Application：
Besides the characteristics of fine diamond micro-powder, Diamond wire micro-powder
has the following characteristics:
1. Adopt high-quality monocrystalline diamond raw materials to ensure the high quality
and stability of the micro-powder through unique raw materials processing technology;
2. After strict processing, it has good dispersibility and wear resistance, provides high cutting
precision, and achieves high productivity and low cost operation:
① Narrow distribution of crystal shape and particle size, and ultra-high regular shape
content together ensure grinding and polishing efficiency, and avoid scratching caused
by abnormal particles;
② Regular crystal shape and extremely concentrated distribution of grit size, form the
concentrated effective grinding particles, and the fine powder particles have high strength.
③ With high purity, less than 50ppm impurity content, it meets the customers’ most
stringent requirements on the quality of the work pieces.
3. Complete granularity size and strict testing technology ensure the stability between batches;
4. The powder is non-magnetic with strong cutting force, proving even sanding result and complete
technical as well as after-sales service;
5. Customized grit shape, size range, and uniformity can be provided to meet customers’ needs.
6. Available in plated products for optimum configuration of diamond powder and diamond wire.
| Diamond wire micro-powder M-TJSD-DW Specification（μm） | ||||
| 4-8 | 5-10 | 6-12 | 8-12 | 8-16 |
| 10-15 | 10-20 | 12-22 | 15-25 | 20-30 |
| 22-36 | 20-40 | 30-40 | 40-50 | 50-60 |
1. Suitable for cutting, grinding and polishing of organic and inorganic brittle materials,
such as: diamond wire, gem saw blade, semiconductor saw blade and other cutting tools.
2. It is suitable for rough grinding, fine grinding and applying on polishing tools of high-tech
materials such as monocrystalline silicon, polycrystalline silicon, diamond, gemstone, sapphire,
quartz plate, LED sapphire substrate, liquid crystal glass, high-precision magnetic material
and semiconductor.
3. Typical end-user applications: ultra-finishing of optical lens mould, polishing of optical lenses,
cutting and grinding of magnetic head, blocking, slicing, back surface grinding and polishing
of silicon chip, slicing and polishing of sapphire chip, cutting and grinding of quartz oscillator,
cutting and grinding of LCD glass, grinding of automobile cylinder, recoverable friction
connection of automobile and engineering parts, etc.
