Tianjian Super-hard materials- high-end micron-nano industrial diamond manufacture and supplier
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TJ Polycrystalline Series

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TJ Polycrystalline Series

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Micron Polycrystalline Diamond Powder M-TJPSD

Micron Polycrystalline Diamond Powder M-TJPSD

Tianjian polycrystalline diamond micro-powder is synthesized by special directional detonation method. Compared with single crystal diamond, there are more crystal edges and grinding surfaces, so it has a high removal rate. With self-sharpening and initial stability, which ensures the quality of the workpiece surface as well as improves the cutting and grinding efficiency, showing its unique superiority in the process of some high quality products.


Application：

It can be used as precision abrasives or coating additives and be made into tools.

  • Product characteristics
  • Specification parameters
  • Application area
  • Product Graphic Appreciation


1. Also known as polycrystalline diamond, synthesized by detonation, 

    the appearance of grayish black is slightly metallic luster;

2. The crystal structure of the particles is very similar to the natural 

    Carbonado, and is combined into a polycrystalline structure by 

    unsaturated bonds;

3. Compared with monocrystaline diamond, it has more crystal edges

    and grinding surfaces, each of which has cutting ability, so it has a high 

    removal rate;

4. Complete particle size specification, stable quality, and small difference

    between  batches;

5. Can achieve ultra high purity, the main impurity content <100ppm;

6. With self-sharpness and toughness, the coarse particles will break into

    smaller particles during the polishing process, which can avoid scratching 

    the surface of the workpiece. The new crack surface has more sharp cutting

    edges, which ensures the the surface quality of the workpiece and improves 

    the grinding and cutting efficiency. It shows unique advantages in the processing 

    of certain high quality products.



                    Micron Polycrystalline Diamond Powder Specification（μm）

0.5-1.5

0.5-2

0-1

0-2

1-2

1-3

2-3

2-4

2-5

3-5

4-6

4-8

5-10

6-12

8-12

8-16





1. Grinding and polishing of sapphire substrate, sapphire window film, 

    optical crystal, watch dial, and mobile glass panel; grinding of LED 

    substrate; grinding slurry for substrate slice; polishing slurry for substrate;

2. Grinding and polishing of zinc selenide crystal, mobile phone camera, 

    hard disk magnetic head, and hard disk surface with high grinding rate, 

    small scratch, and high surface finish; grinding of zinc selenide; and 

    polishing of laser crystal;

3. Polishing of glass and mold; and grinding of metal, aluminum alloy, 

    stainless steel, tungsten carbide, mold, ceramics, mobile phone shell.